Characteristics of four layer red oil gold plate:

1. The crystal structure formed by the gold plate is different, golden yellow, stable in color and good in glossiness, which will not cause poor welding. Customers prefer it.

2. Only the bonding pad of the gold plate has nickel gold, and the signal transmission in the skin effect will not affect the signal in the copper layer.

3. The crystal structure of the gold plate is more compact, and it is not easy to produce oxidation.

4. With the increasingly dense wiring, the line width and spacing have reached 3-4 mils. Gold plating is easy to cause gold wire short circuit. Only the bonding pad of the gold plate has nickel gold, so gold wire short circuit will not occur.

5. Only the bonding pad of the gold plate has nickel gold, so the bonding between the solder mask and the copper layer on the circuit is more firm. The project will not affect the spacing when making compensation.

6. Compared with the boards with higher requirements, the flatness of the boards is better. Generally, the metal sinking is adopted, and the black pad phenomenon after assembly will not occur. The flatness and service life of the gold plated plate are as good as those of the gold plated plate.

7. After three times of high temperature welding of the gold plate, it can be seen that the solder joints of the gold plate card are full, bright and well welded, and will not affect the activity of solder paste and flux.

8. The gilt plate can be directly measured before and after production and shipment. The operation technology is simple and is not affected by other conditions

9. The heat dissipation of the gold plated board is good because of the good heat conductivity of gold. The pad made of gold has good heat conductivity, which makes it the best heat dissipation. With good heat dissipation, the temperature of the PCB board is low, and the chip works more stably.